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華天科技存儲封裝包含TSSOP，DFN，LGA，BGA封裝，產(chǎn)品線涵蓋Nor Flash，SPI NAND，SD NAND，3D V-NAND，eMMC，eMCP，UFS，LPDDR，DDR系列，滿足客戶高密度高速度
存儲封裝需求。
Memory產(chǎn)品類別：FLASH | DRAM | Embedded
應用領(lǐng)域
Solid state disk or USB flash disk 手機、車載、智能家居等多個領(lǐng)域。
代表產(chǎn)品
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3D-VNAND
Specification:
Package Size: 12x18mm 132Ball
Package thickness：1.12mm /1.32mm
Min Die thickness: 30um
8 die –stack/16 die –stack
Substrate thickness:0.13mmApplication:
Solid state disk or USB flash disk -
LPDDR4
Specification:
Package Size: 10x14.5mm 200Ball
Package thickness： 0.92mm
Min Die thickness: 40um
2 die –stack/4 die –stack
Substrate thickness:0.18mm 2L/4LApplication:
Mobile electronics DRAM -
eMMC
Specification:
Package Size: 11.5x13mm 153 Ball
Package thickness： 0.92mm
Min Die thickness: 80um
2 die –stack
Substrate thickness:0.18mm 2LApplication:
Mobile phone, Flat PC, Smart Watch -
eMCP
Specification:
Package Size: 8x10.5mm 162Ball
Package thickness： 0.92mm
Min Die thickness: 80um
3 die –stack
Substrate thickness:0.18mm 2LApplication:
Mobile phone, Flat PC,IoT, Wearable device