當(dāng)前位置：首頁-產(chǎn)品技術(shù)-MEMS
MEMS（微機(jī)電系統(tǒng)封裝）產(chǎn)品具有體積小、重量輕、功耗低、靈敏度高、價(jià)格低、易批量生產(chǎn)等優(yōu)點(diǎn)。
MEMS產(chǎn)品種類繁多，封裝形式多樣，產(chǎn)品應(yīng)用范圍廣，隨著科技的不斷發(fā)展，與人類的日常生活關(guān)聯(lián)越來越緊密。
MEMS產(chǎn)品類別：
01 聲學(xué)類：硅麥克風(fēng)
02 壓力類：高度計(jì)，氣壓計(jì)，3Dtouch
03 慣性類：加速度計(jì)，陀螺儀，6lMU
04 光學(xué)類：接近光傳感器，光電傳感器，Vcsel，心率傳感器，TOF
05 RFMEMS：濾波器（SAW&BAW）
06 磁傳感器：AMR，TMR
07 生物類：基因檢測(cè)傳感器
08 指紋類：光學(xué)式指紋，電容式指紋
09 熱學(xué)類：溫濕度傳感器，溫度傳感器
技術(shù)能力
TSV, RDL, WLCSP, Wafer tevwel bonding, Strip level bonding FC+WB stack die, Coating protection Metal lid attach,
Glass attach Compression molding Customize molding Clear molding, Open molding Can supply ceramic, lead frame,
substrate solutions, various assembly proposal fulfill customer requirements.
應(yīng)用領(lǐng)域
手機(jī)，平板電腦，智能穿戴，醫(yī)療服務(wù)，工業(yè)生產(chǎn)，汽車電子等多種領(lǐng)域。
代表產(chǎn)品
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Cap Mount Product
Specification:
Package Size: 4030,3526,3729,3722,2718
Port Location: Top / Bottom
Cap Type: Metal / Plastic / SubstrateApplication:
Silicon Microphone, Pressure Sensor -
Customized Mold Product
Specification:
Package Type: QFN / LGA
Mold Type: Full Open Mold / Partial Open MoldApplication:
THTB, Optical Sensor, Heart rate sensor etc. -
Over Molding Product
Specification:
Package Type：QFN / LGA
Die Attach Orientation: Horizontal(0° or 180°） / Vertical （90°）Application:
G-sensor, AMR/TMR , Multi-axis Inertial
sensor，RF Filter -
Finger Print Sensor
Specification:
Package Type: QFN / LGA
Mold clearance : Min. 50 um(Over Molding)
Wire loop：Max 30um
Package thickness：Min 0.5mm
Package Outline: Rectangle / CircleApplication:
Mobile Phone, Credit Card , Door Lock,
Suitcase, ID Card etc.